MobiSys Acceptance Rate and Submission Statistics

ACM International Conference on Mobile Systems, Applications, and Services is tracked by CS Conf Stats as a Mobile conference. The dataset covers 23 events from 2003-2025.

MobiSys 2025 accepted 42 papers out of 233 submissions, for an acceptance rate of 18.0%.

Official website | Proceedings

Latest Acceptance Rate
18.0%
2025: 42 accepted / 233 submitted
Years Covered
23
2003-2025
Discipline
Mobile
Mobile Systems, Mobile Networks, Ubiquitous and Pervasive Computing, Mobile Applications and Services

Yearly Statistics

Year Location Accepted Submitted Acceptance Rate Second Track Note
2025 Anaheim, California, USA 42 233 18.0%
2024 Tokyo, Japan 43 263 16.3%
2023 Helsinki, Finland 41 198 20.7%
2022 Portland, USA 38 176 21.6%
2021 Online, Online 36 166 21.7%
2020 Toronto, Canada 34 175 19.4%
2019 Seoul, Korea 39 172 22.7%
2018 Munich, Germany 37 138 26.8%
2017 Niagara Falls, USA 34 188 18.1%
2016 Singapore, Singapore 31 197 15.7%
2015 Florence, Italy 29 219 13.2%
2014 Bretton Woods, USA 25 185 13.5%
2013 Taipei, Taiwan, China 33 211 15.6%
2012 Low Wood Bay, Lake District, UK 32 182 17.6%
2011 Bethesda, USA 25 141 17.7%
2010 San Francisco, California, USA 25 126 19.8%
2009 Krakow, Poland 26 128 20.3%
2008 Breckenridge, USA 22 123 17.9%
2007 San Juan, Puerto Rico 22 105 21.0%
2006 Uppsala, Sweden 19 123 15.4%
2005 Seattle, USA 20 84 23.8%
2004 Boston, USA 22 162 13.6%
2003 San Francisco, California, USA 23 153 15.0%

Conference Details

Full Title
ACM International Conference on Mobile Systems, Applications, and Services
Main Discipline
Mobile Systems, Mobile Networks, Ubiquitous and Pervasive Computing, Mobile Applications and Services
Other Topics
Mobile Security & Privacy, Energy Efficiency in Mobile Systems, Sensor Networks, IoT, AR & VR, Edge Computing, Cloud Computing
Parent Organization
ACM SIGMOBILE
Notes
Wow! This conference's data are complete! 🏆

More MobiSys Pages

Interactive chart: MobiSys on the main CS Conf Stats chart.

Related Mobile conferences: MobiCom, SenSys.