DAC Acceptance Rate and Submission Statistics

Design Automation Conference is tracked by CS Conf Stats as a EDA conference. The dataset covers 29 events from 1984-2024.

DAC 2024 accepted 337 papers out of 1,545 submissions, for an acceptance rate of 21.8%.

Latest Acceptance Rate

21.8%

2024: 337 accepted / 1,545 submitted

Years Covered

1984-2024

Discipline

EDA

Electronic Design Automation, Chips to Systems

Yearly Statistics

Year	Location	Accepted	Submitted	Acceptance Rate	Note
2024	San Francisco, California, USA	337	1,545	21.8%
2023	San Francisco, California, USA	263	1,156	22.8%
2022	San Francisco, California, USA	223	987	22.6%
2021	Online, Online	215	914	23.5%
2020	San Francisco, California, USA	228	984	23.2%
2019	Las Vegas, USA	202	815	24.8%
2018	San Francisco, California, USA	168	691	24.3%
2013	Austin, USA	155	740	20.9%
2011	San Diego, California, USA	156	690	22.6%
2010	Anaheim, California, USA	148	607	24.4%
2009	San Francisco, California, USA	150	682	22.0%	Estimated acc, ~22%
2008	Anaheim, California, USA	147	639	23.0%
2007	San Diego, California, USA	152	659	23.1%
2006	San Francisco, California, USA	210	865	24.3%
2005	Anaheim, California, USA	154	735	21.0%
2004	San Diego, California, USA	163	785	20.8%
2003	Anaheim, California, USA	152	628	24.2%
2002	New Orleans, USA	147	491	29.9%
1999	New Orleans, USA	154	451	34.1%
1997	Anaheim, California, USA	139	400	34.8%
1996	Las Vegas, USA	142	377	37.7%
1994	San Diego, California, USA	116	450	25.8%	Nearly 450
1993	Dallas, USA	126	453	27.8%
1990	Orlando, USA	125	427	29.3%
1989	Las Vegas, USA	156	465	33.5%
1988	Anaheim, California, USA	125	400	31.3%
1987	Miami, USA	138	351	39.3%
1986	Las Vegas, USA	124	300	41.3%	Over 300 submitted papers
1984	Albuquerque, USA	116	290	40.0%

Full Title: Design Automation Conference
Main Discipline: Electronic Design Automation, Chips to Systems
Other Topics: Security, Systems, Low Power Design, Chiplet Integration, Cloud Computing in EDA
Parent Organization: ACM, IEEE
Notes: No conference-level note is recorded.

Related EDA conferences: ICCAD.